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Facile galvanic replacement deposition of nickel on copper substrate in deep eutectic solvent and its activation ability for electroless Ni–P plating 期刊论文
Journal of Solid State Electrochemistry, 2022, 期号: 26, 页码: 1313–1322
Authors:  Guanqun Hu;  Rui Huang;  Hongli Wang;  Qiuping Zhao;  Xingkai Zhang
Adobe PDF(3060Kb)  |  Favorite  |  View/Download：35/0  |  Submit date：2022/12/12
Aluminum-induced direct electroless deposition of Co and Co-P coatings on copper and their catalytic performance for electrochemical water splitting 期刊论文
Surface and Coatings Technology, 2018, 期号: 352, 页码: 42–48
Authors:  Zhang, Xingkai;  Wang, Fuguo;  Zhou, Yan;  Liang, Aimin;  Zhang, Junyan
Adobe PDF(2906Kb)  |  Favorite  |  View/Download：144/3  |  Submit date：2018/11/19
Growth Kinetics of Copper Replacement Deposition on Al and Al-Si from a Deep Eutectic Solvent 期刊论文
Journal of The Electrochemical Society, 2015, 卷号: 162, 期号: 10, 页码: D515-D519
Authors:  Kang RX(康瑞雪);  Liang J(梁军);  Qiao ZH(乔竹辉);  Peng ZJ(彭振军);  Liang J(梁军)
Adobe PDF(756Kb)  |  Favorite  |  View/Download：124/2  |  Submit date：2015/11/04
Al-si Alloy  Copper Galvanic Replacement  Deep Eutectic Solvent  Growth Kinetics  Pure Al  
Superamphiphobic self-assembled monolayer of thiol on the structured Zn surface 期刊论文
Colloids and Surfaces A: Physicochemical and Engineering Aspects, 2012, 卷号: 396, 页码: 90-95
Authors:  Xu XH(徐向辉);  Zhang ZZ(张招柱);  Guo F(郭芳);  Yang J(杨进);  Zhu XT(朱小涛);  Zhou XY(周晓燕);  Xue QJ(薛群基);  Zhang ZZ(张招柱)
Adobe PDF(1827Kb)  |  Favorite  |  View/Download：242/2  |  Submit date：2013/07/12
Electroless Deposition  Surface Morphology  Superhydrophobic  Chemical Stability