| Facile galvanic replacement deposition of nickel on copper substrate in deep eutectic solvent and its activation ability for electroless Ni–P plating | |
| Department | 中国科学院材料磨损与防护重点实验室/先进润滑与防护材料研究发展中心 |
Guanqun Hu1,2; Rui Huang3; Hongli Wang4; Qiuping Zhao2; Xingkai Zhang1
| |
| The second department | 纳米润滑组 |
| 2022-04-19 | |
| Source Publication | Journal of Solid State Electrochemistry
 |
| Issue | 26Pages:1313–1322 |
| If | 2.747 |
| Language | 英语 |
| compositor | 第一作者单位 |
| Document Type | 期刊论文 |
| Identifier | http://ir.licp.cn/handle/362003/29660 |
| Collection | 中国科学院材料磨损与防护重点实验室/先进润滑与防护材料研究发展中心 |
| Corresponding Author | Xingkai Zhang |
| Affiliation | 1.Key Laboratory of Science and Technology On Wear and Protection of Materials, Lanzhou Institute of Chemical Physics, Chinese Academy of Sciences 2.College of Petrochemical Technology, Lanzhou University of Technology 3.College of Physics and Electronic Engineering, Northwest Normal University 4.State Key Laboratory for Oxo Synthesis and Selective Oxidation, Lanzhou Institute of Chemical Physics, Chinese Academy of Sciences |
| Recommended Citation GB/T 7714 | Guanqun Hu,Rui Huang,Hongli Wang,等. Facile galvanic replacement deposition of nickel on copper substrate in deep eutectic solvent and its activation ability for electroless Ni–P plating[J]. Journal of Solid State Electrochemistry,2022(26):1313–1322. |
| APA | Guanqun Hu,Rui Huang,Hongli Wang,Qiuping Zhao,&Xingkai Zhang.(2022).Facile galvanic replacement deposition of nickel on copper substrate in deep eutectic solvent and its activation ability for electroless Ni–P plating.Journal of Solid State Electrochemistry(26),1313–1322. |
| MLA | Guanqun Hu,et al."Facile galvanic replacement deposition of nickel on copper substrate in deep eutectic solvent and its activation ability for electroless Ni–P plating".Journal of Solid State Electrochemistry .26(2022):1313–1322. |
| Files in This Item: | ||||||
| File Name/Size | DocType | Version | Access | License | ||
| Facile galvanic repl（3060KB） | 期刊论文 | 作者接受稿 | 开放获取 | CC BY-NC-SA | View Application Full Text | |
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