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Facile galvanic replacement deposition of nickel on copper substrate in deep eutectic solvent and its activation ability for electroless Ni–P plating 期刊论文
Journal of Solid State Electrochemistry, 2022, 期号: 26, 页码: 1313–1322
Authors:  Guanqun Hu;  Rui Huang;  Hongli Wang;  Qiuping Zhao;  Xingkai Zhang
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