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Damping, thermal, and mechanical performances of a novel semi-interpenetrating polymer networks based on polyimide/epoxy 期刊论文
Journal of Applied Polymer Science, 2019, 卷号: 2019, 期号: 136, 页码: 48032
Authors:  Chunhui Qu;  Xiao Li;  Zenghui Yang;  Xinrui Zhang;  Tingmei Wang;  Qihua Wang;  Shoubing Chen
Adobe PDF(4246Kb)  |  Favorite  |  View/Download：74/0  |  Submit date：2021/01/26
blends  compatibilization  glass transition  membranes  polyimides  
Direct Ink Writing of High Performance Architectured Polyimides with Low Dimensional Shrinkage 期刊论文
Advanced Engineering Materials, 2019, 期号: 21, 页码: 1801314
Authors:  Guo YX(郭玉雄);  Xu JW(徐嘉文);  Yan CY(闫昌友);  Chen YQ(陈彦秋);  Zhang XQ(张晓琴);  Jia X(贾鑫);  Liu Y(刘禹);  Wang XL(王晓龙);  Zhou F(周峰)
Adobe PDF(5065Kb)  |  Favorite  |  View/Download：114/2  |  Submit date：2019/11/16
3D printing  low dimensional shrinkage  photocuring direct ink writing  polyimides  thermoset polymers