Damping, thermal, and mechanical performances of a novel semi-interpenetrating polymer networks based on polyimide/epoxy | |
Department | 中国科学院材料磨损与防护重点实验室/先进润滑与防护材料研究发展中心 |
Chunhui Qu1; Xiao Li2; Zenghui Yang3; Xinrui Zhang4; Tingmei Wang5; Qihua Wang6; Shoubing Chen7 | |
The second department | 602 |
2019-05-13 | |
Source Publication | Journal of Applied Polymer Science |
Volume | 2019Issue:136Pages:48032 |
Abstract | In this article, a series of novel semi-interpenetrating polymer networks (s-IPNs) based on linear polyimide (PI) and crosslinked epoxy (EP) were firstly prepared aiming at controlling violent vibration and noise originating from operation of the machine. The damping, thermal, and mechanical performances of s-IPNs films were systematically investigated in terms of the structure of polyimide (themolar ratios of diamines) and the component ratios of PI/EP. The results indicate that PI/EP s-IPNs films exhibit prominent damping properties, and the effective damping temperature range can reach up to 58.8 ℃ when molar ratio of diamines is 1:3 within PI and component ratio of PI/EP is 70:30. Meanwhile, all the PI/EP s-IPNs films show good thermal stability compared to cured EP and certain mechanical behaviors due to the formation of semi- interpenetrated structure. Meaningfully, the prepared novel PI/EP s-IPNs will be used as effective damping materials and have a potential application in damping fields. |
Keyword | blends compatibilization glass transition membranes polyimides |
MOST Discipline Catalogue | 工学 |
DOI | 10.1002/app.48032 |
URL | 查看原文 |
Indexed By | SCI |
If | 2.520 |
Language | 英语 |
Funding Project | 形状记忆聚合物内摩擦与宏观减摩抗磨机理的关系研究 ; 形状记忆聚合物内摩擦与宏观减摩抗磨机理的关系研究 |
compositor | 第一作者单位 |
Citation statistics | |
Document Type | 期刊论文 |
Identifier | http://ir.licp.cn/handle/362003/27059 |
Collection | 中国科学院材料磨损与防护重点实验室/先进润滑与防护材料研究发展中心 |
Corresponding Author | Tingmei Wang; Shoubing Chen |
Affiliation | 1.兰州化学物理研究所 2.兰州化学物理研究所 3.兰州化学物理研究所 4.兰州化学物理研究所 5.兰州化学物理研究所 6.兰州化学物理研究所 7.兰州化学物理研究所 |
Recommended Citation GB/T 7714 | Chunhui Qu,Xiao Li,Zenghui Yang,et al. Damping, thermal, and mechanical performances of a novel semi-interpenetrating polymer networks based on polyimide/epoxy[J]. Journal of Applied Polymer Science,2019,2019(136):48032. |
APA | Chunhui Qu.,Xiao Li.,Zenghui Yang.,Xinrui Zhang.,Tingmei Wang.,...&Shoubing Chen.(2019).Damping, thermal, and mechanical performances of a novel semi-interpenetrating polymer networks based on polyimide/epoxy.Journal of Applied Polymer Science,2019(136),48032. |
MLA | Chunhui Qu,et al."Damping, thermal, and mechanical performances of a novel semi-interpenetrating polymer networks based on polyimide/epoxy".Journal of Applied Polymer Science 2019.136(2019):48032. |
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app.48032.pdf(4246KB) | 期刊论文 | 作者接受稿 | 开放获取 | CC BY-NC-SA | View Application Full Text |
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