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一种聚酰亚胺/还原氧化石墨烯复合材料的制备方法及其应用 专利
专利号: ZL202210592765.3, 申请日期: 2022-12-27,
Inventors:  杨增辉;  王炎;  王晓月;  张新瑞;  王廷梅;  王齐华
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Molecularly Engineered Unparalleled Strength and Super Toughness Poly(urea‐urethane) with Shape Memory and Clusterization‐triggered Emission 期刊论文
Advanced Materials, 2022, 期号: 34, 页码: 2205763-2205772
Authors:  Xiaoyue Wang;  Jing Xu;  Xinrui Zhang;  Zenghui Yang;  Yaoming Zhang;;  Tingmei Wang;  Qihua Wang
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一种聚氨酯改性环氧树脂 胶黏材料及其制备方法和应用 专利
专利类型: 发明专利, 专利号: ZL202210018997.8, 申请日期: 2022-09-20,
Inventors:  陈守兵;  王进;  琚浩;  张耀明;  张昌盛;  杨增辉;  王廷梅;  王齐华;  姜一卉;  刘建峰
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3D structurally advanced graphene oxide/h-BN hybrid for solid self-lubrication with enhanced thermal conductivity 期刊论文
Tribology International, 2022, 期号: 176, 页码: 197618
Authors:  Nan Zhang;  Yaoming Zhang;  Song Li;  Lihe Guo;  Zenghui Yang;  Xinrui Zhang;  Tingmei Wang;  Qihua Wang
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Room-temperature self-healing supramolecular polyurethanes based on the synergistic strengthening of biomimetic hierarchical hydrogen-bonding interactions and coordination bonds 期刊论文
Chemical Engineering Journal, 2022, 期号: 451, 页码: 138673
Authors:  Jing Xu;  Xiaoyue Wang;  Xinrui Zhang;  Zenghui Yang;  Song Li;  Liming Tao;  Qihua Wang;  Tingmei Wang
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一种柔性涂覆材料及其制备方法和应用 专利
专利号: 202210018955.4, 申请日期: 2022-07-19,
Inventors:  杨增辉;  王进;  王廷梅;  石丹;  王佳颖;  陈守兵;  谢海;  王齐华
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High-strength, high-toughness, self-healing thermosetting shape memory polyurethane enabled by dual dynamic covalent bonds 期刊论文
Polymer Chemistry, 2022, 期号: 13, 页码: 3422-3432
Authors:  Xiaoyue Wang;  Jing Xu;  Yaoming Zhang;  Tingmei Wang;  Qihua Wang;  Zenghui Yang;  Xinrui Zhang
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Recent advances in high-strength and high-toughness polyurethanes based on supramolecular interactions 期刊论文
Polymer Chemistry, 2022, 期号: 13, 页码: 2420-2441
Authors:  Jing Xu;  Xiaoyue Wang;  Hongwei Ruan;  Xinrui Zhang;  Yaoming Zhang;  Zenghui Yang;  Qihua Wang;  Tingmei Wang
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一种耐空间原子氧、光学透明的热固性形状记忆聚酰亚胺及其制备方法和应用 专利
专利号: 202110454005.1, 申请日期: 2022-02-08,
Inventors:  杨增辉;  张耀明;  陶立明;  张新瑞;  王齐华;  王廷梅
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Flexible and quasi-isotropically thermoconductive polyimide films by guided assembly of boron nitride nanoplate/boron nitride flakes for microelectronic application 期刊论文
Chemical Engineering Journal, 2022, 期号: 431, 页码: 133740
Authors:  An Lulu;  Yang Zenghui;  Zeng Xiaoliang;  Hu Wanbiao;  Yu Yuanlie;  Zhang Junyan;  Wang Qihua
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