| Flexible and quasi-isotropically thermoconductive polyimide films by guided assembly of boron nitride nanoplate/boron nitride flakes for microelectronic application | |
| Department | 中国科学院材料磨损与防护重点实验室/先进润滑与防护材料研究发展中心 |
An Lulu; Yang Zenghui ; Zeng Xiaoliang; Hu Wanbiao; Yu Yuanlie; Zhang Junyan; Wang Qihua
| |
| The second department | 607组 |
| 2022 | |
| Source Publication | Chemical Engineering Journal
 |
| Issue | 431Pages:133740 |
| If | 16.744 |
| compositor | 第一作者单位 |
| Document Type | 期刊论文 |
| Identifier | http://ir.licp.cn/handle/362003/29961 |
| Collection | 中国科学院材料磨损与防护重点实验室/先进润滑与防护材料研究发展中心 |
| Corresponding Author | An Lulu; Wang Qihua |
| Recommended Citation GB/T 7714 | An Lulu,Yang Zenghui,Zeng Xiaoliang,et al. Flexible and quasi-isotropically thermoconductive polyimide films by guided assembly of boron nitride nanoplate/boron nitride flakes for microelectronic application[J]. Chemical Engineering Journal,2022(431):133740. |
| APA | An Lulu.,Yang Zenghui.,Zeng Xiaoliang.,Hu Wanbiao.,Yu Yuanlie.,...&Wang Qihua.(2022).Flexible and quasi-isotropically thermoconductive polyimide films by guided assembly of boron nitride nanoplate/boron nitride flakes for microelectronic application.Chemical Engineering Journal(431),133740. |
| MLA | An Lulu,et al."Flexible and quasi-isotropically thermoconductive polyimide films by guided assembly of boron nitride nanoplate/boron nitride flakes for microelectronic application".Chemical Engineering Journal .431(2022):133740. |
| Files in This Item: | ||||||
| File Name/Size | DocType | Version | Access | License | ||
| Flexible and quasi-i（19078KB） | 期刊论文 | 作者接受稿 | 开放获取 | CC BY-NC-SA | View Application Full Text | |
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