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Biphenyl Containing Shape Memory Epoxy Resin with Post-heating Adjustable Properties 期刊论文
MACROMOLECULAR MATERIALS AND ENGINEERING, 2021, 卷号: 30, 期号: 8, 页码: 2100185
Authors:  Yang, Jing;  Tao, Liming;  Cao, Pengrui;  Yang, Zenghui;  Zhang, Xinrui;  Wang, Qihua;  Wang, Tingmei;  Luo, Heming;  Zhang, Yaoming
Adobe PDF(2903Kb)  |  Favorite  |  View/Download:93/0  |  Submit date:2021/11/20
Fabrication of high-aspect-ratio polydimethylsiloxane microstructures by reducing the interfacial adhesion in soft lithography 期刊论文
Journal of Micromechanics and Microengineering, 2021, 卷号: 30, 期号: 2021, 页码: 075004
Authors:  Zhou B(周波);  Su B(苏博);  Wurui, Ta;  Zenghui Yang;  Meng JH(孟军虎)
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