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A protocol for fast electroless Ni-P on Al alloy at medium-low temperature accelerated by hierarchically structured Cu immersion layer 期刊论文
Surface & Coatings Technology, 2017, 卷号: 309, 页码: 67-74
Authors:  Kang RX(康瑞雪);  Peng ZJ(彭振军);  Liu BX(刘百幸);  Wang DA(王道爱);  Liang J(梁军);  Liang J(梁军);  Wang DA(王道爱)
Adobe PDF(1924Kb)  |  Favorite  |  View/Download：124/4  |  Submit date：2017/04/07
Cu Immersion  Deep Eutectic Solvent  Accelerator  Electroless Ni-p  Medium-low Temperature  
Growth Kinetics of Copper Replacement Deposition on Al and Al-Si from a Deep Eutectic Solvent 期刊论文
Journal of The Electrochemical Society, 2015, 卷号: 162, 期号: 10, 页码: D515-D519
Authors:  Kang RX(康瑞雪);  Liang J(梁军);  Qiao ZH(乔竹辉);  Peng ZJ(彭振军);  Liang J(梁军)
Adobe PDF(756Kb)  |  Favorite  |  View/Download：119/2  |  Submit date：2015/11/04
Al-si Alloy  Copper Galvanic Replacement  Deep Eutectic Solvent  Growth Kinetics  Pure Al  
Copper Galvanic Replacement on Aluminum from a Choline Chloride Based Ionic Liquid: Effect of Thiourea 期刊论文
Journal of The Electrochemical Society, 2014, 卷号: 161, 期号: 10, 页码: D534-D539
Authors:  Kang RX(康瑞雪);  Liang J(梁军);  Liu BX(刘百幸);  Peng ZJ(彭振军);  Liang J(梁军)
Adobe PDF(646Kb)  |  Favorite  |  View/Download：307/2  |  Submit date：2014/11/27