A protocol for fast electroless Ni-P on Al alloy at medium-low temperature accelerated by hierarchically structured Cu immersion layer | |
Department | 固体润滑国家重点实验室 |
Kang RX(康瑞雪)1,2; Peng ZJ(彭振军)1; Liu BX(刘百幸)1; Wang DA(王道爱)1; Liang J(梁军)1; Liang J(梁军); Wang DA(王道爱) | |
2017 | |
Source Publication | Surface & Coatings Technology |
ISSN | 0257-8972 |
Volume | 309Pages:67-74 |
Abstract | Electroless Ni-P coating is helpful to improve the corrosion resistance and mechanical properties of the Al alloys. However, the electroless Ni-P plating is usually operated at higher temperature (above 80 °C, even up to 90 °C) in order to achieve appropriate deposition rate. Herein it is demonstrated that a novel Cu immersion layer on Al alloy with a hierarchical structure can significantly accelerate the electroless Ni-P process in a wide range of temperature. The hierarchically structured Cu layer is deposited on Al alloy through galvanic replacement deposition from an environment-friendly deep eutectic solvent comprising choline chloride and ethylene glycol. The hierarchical structure of Cu immersion layer strongly affects the nucleation and growth of Ni-P, which is beneficial for enhancing the deposition rate of electroless process. This protocol might be of interest in the fast fabrication of electroless Ni-P deposition on Al alloys at medium and low temperature (50 °C ~ 70 °C). |
Keyword | Cu Immersion Deep Eutectic Solvent Accelerator Electroless Ni-p Medium-low Temperature |
Subject Area | 材料科学与物理化学 |
DOI | 10.1016/j.surfcoat.2016.11.029 |
Funding Organization | National Natural Science Foundation of China (Grant No. 51305432);the “Hundred Talents Program” of Chinese Academy of Sciences (J. Liang) (Y00230YBR1) |
Indexed By | SCI |
If | 2.589 |
Language | 英语 |
Funding Project | 空间润滑材料研究组;材料表面界面研究组 |
compositor | 第一作者单位 |
Citation statistics | |
Document Type | 期刊论文 |
Identifier | http://ir.licp.cn/handle/362003/21534 |
Collection | 固体润滑国家重点实验室(LSL) |
Corresponding Author | Liang J(梁军); Wang DA(王道爱) |
Affiliation | 1.Chinese Acad Sci, Lanzhou Inst Chem Phys, State Key Lab Solid Lubricat, Lanzhou 730000, Peoples R China 2.Univ Chinese Acad Sci, Beijing 100049, Peoples R China |
Recommended Citation GB/T 7714 | Kang RX,Peng ZJ,Liu BX,et al. A protocol for fast electroless Ni-P on Al alloy at medium-low temperature accelerated by hierarchically structured Cu immersion layer[J]. Surface & Coatings Technology,2017,309:67-74. |
APA | Kang RX.,Peng ZJ.,Liu BX.,Wang DA.,Liang J.,...&王道爱.(2017).A protocol for fast electroless Ni-P on Al alloy at medium-low temperature accelerated by hierarchically structured Cu immersion layer.Surface & Coatings Technology,309,67-74. |
MLA | Kang RX,et al."A protocol for fast electroless Ni-P on Al alloy at medium-low temperature accelerated by hierarchically structured Cu immersion layer".Surface & Coatings Technology 309(2017):67-74. |
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1-s2.0-S025789721631(1924KB) | 期刊论文 | 作者接受稿 | 开放获取 | CC BY-NC-SA | View Application Full Text |
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