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Facile galvanic replacement deposition of nickel on copper substrate in deep eutectic solvent and its activation ability for electroless Ni–P plating 期刊论文
Journal of Solid State Electrochemistry, 2022, 期号: 26, 页码: 1313–1322
Authors:  Guanqun Hu;  Rui Huang;  Hongli Wang;  Qiuping Zhao;  Xingkai Zhang
Adobe PDF(3060Kb)  |  Favorite  |  View/Download：35/0  |  Submit date：2022/12/12
Catalytic superlubricity via in-situ formation of graphene during sliding friction on Au@a-C:H films 期刊论文
Carbon, 2022, 期号: 186, 页码: 180-192
Authors:  Qian Jia;  Zaixiu Yang;  Lei Sun;  Kaixiong Gao;  Bin Zhang;  Xingkai Zhang;  Junyan Zhang
Adobe PDF(5234Kb)  |  Favorite  |  View/Download：64/1  |  Submit date：2023/01/13