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Morphology and thermal stability of Ti-doped copper nitride films 期刊论文
JOURNAL OF PHYSICS D: APPLIED PHYSICS, 2007, 卷号: 40, 页码: 3430-3435
Authors:  Fan XY(范晓彦);  Wu ZG(吴志国);  Li HJ(李华军);  Geng BS(耿柏松);  Li C(李春);  Yan PX(阎鹏勋)
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Structure evolution and mechanical properties enhancement of Al/AlN multilayer 期刊论文
Applied Surface Science, 2007, 卷号: 253, 页码: 8835-8840
Authors:  Zhang GA(张广安);  Wu ZG(吴志国);  Wang MX(王明旭);  Fan XY(范晓彦);  Wang J(王君);  Yan PX(阎鹏勋)
Adobe PDF(869Kb)  |  Favorite  |  View/Download：85/0  |  Submit date：2013/11/01
Magnetron Sputtering  Al/aln Multilayer  Structure  Hardness  Wear Properties  
Ti-doped copper nitride films deposited by cylindrical magnetron sputtering 期刊论文
Journal of Alloys and Compounds, 2007, 卷号: 440, 页码: 254-258
Authors:  Fan XY(范晓彦);  Wu ZG(吴志国);  Zhang GA(张广安);  Li C(李春);  Geng BS(耿柏松);  Li HJ(李华军);  Yan PX(阎鹏勋)
Adobe PDF(881Kb)  |  Favorite  |  View/Download：97/0  |  Submit date：2013/11/01
Copper Nitride  Surface Morphology  Electrical Resistivity  Optical Band Gap