| Morphology and thermal stability of Ti-doped copper nitride films | |
| Department | 固体润滑国家重点实验室 |
| Fan XY(范晓彦); Wu ZG(吴志国); Li HJ(李华军); Geng BS(耿柏松); Li C(李春); Yan PX(阎鹏勋) | |
| 2007 | |
| Source Publication | JOURNAL OF PHYSICS D: APPLIED PHYSICS
 |
| ISSN | 0022-3727 |
| Volume | 40Pages:3430-3435 |
| Abstract | A weakly Ti-doped copper nitride (Cu3N) film was prepared by cylindrical magnetron sputtering. The XPS results indicate that Ti atoms do not substitute for the Cu atoms but probably locate at the grain boundaries. The columnar grains size is about half of that of the undoped Cu3N film and the surface is smoother. For weakly Ti-doped Cu3N films, a dense layer appears on top of the columnar crystals. The RMS of the Cu film formed by annealing of the weakly Ti-doped Cu3N film is more than twice larger than that of the film before annealing. Compared with the undoped Cu3N film, it possesses fine thermal stability both in vacuum and in atmosphere. |
| Subject Area | 材料科学与物理化学 |
| Funding Organization | the Nature Science Foundation of Gansu Province, People’s Republic of China. The project number is ZS021-A25-022-C |
| Indexed By | SCI |
| Language | 英语 |
| Citation statistics | |
| Document Type | 期刊论文 |
| Identifier | http://ir.licp.cn/handle/362003/4062 |
| Collection | 固体润滑国家重点实验室（LSL） |
| Corresponding Author | Yan PX(阎鹏勋) |
| Recommended Citation GB/T 7714 | Fan XY,Wu ZG,Li HJ,et al. Morphology and thermal stability of Ti-doped copper nitride films[J]. JOURNAL OF PHYSICS D: APPLIED PHYSICS,2007,40:3430-3435. |
| APA | 范晓彦,吴志国,李华军,耿柏松,李春,&阎鹏勋.(2007).Morphology and thermal stability of Ti-doped copper nitride films.JOURNAL OF PHYSICS D: APPLIED PHYSICS,40,3430-3435. |
| MLA | 范晓彦,et al."Morphology and thermal stability of Ti-doped copper nitride films".JOURNAL OF PHYSICS D: APPLIED PHYSICS 40(2007):3430-3435. |
| Files in This Item: | ||||||
| File Name/Size | DocType | Version | Access | License | ||
| 20073430-3435.pdf（1596KB） | 开放获取 | CC BY-NC-SA | View Application Full Text | |||
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