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Facile galvanic replacement deposition of nickel on copper substrate in deep eutectic solvent and its activation ability for electroless Ni–P plating 期刊论文
Journal of Solid State Electrochemistry, 2022, 期号: 26, 页码: 1313–1322
Authors:  Guanqun Hu;  Rui Huang;  Hongli Wang;  Qiuping Zhao;  Xingkai Zhang
Adobe PDF(3060Kb)  |  Favorite  |  View/Download：35/0  |  Submit date：2022/12/12
低温等离子体在电化学储能器件表面修饰的应用 期刊论文
过程工程学报, 2022, 卷号: 224, 期号: 9, 页码: 1159-1168
Authors:  王政德;  高凯雄;  张斌
Adobe PDF(1613Kb)  |  Favorite  |  View/Download：12/0  |  Submit date：2023/12/08
等离子体  电化学储能器件  表面改性  技术应用