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Facile galvanic replacement deposition of nickel on copper substrate in deep eutectic solvent and its activation ability for electroless Ni–P plating 期刊论文
Journal of Solid State Electrochemistry, 2022, 期号: 26, 页码: 1313–1322
Authors:  Guanqun Hu;  Rui Huang;  Hongli Wang;  Qiuping Zhao;  Xingkai Zhang
Adobe PDF(3060Kb)  |  Favorite  |  View/Download：35/0  |  Submit date：2022/12/12
Direct electro-phosphorization of nickel and cobalt films in hypophosphite solution for efficient hydrogen evolution 期刊论文
Inorganic Chemistry Communications, 2021, 期号: 127, 页码: 108555
Authors:  Qingyi Qian;  Fan Wang;  Xingkai Zhang;  Qiuping Zhao
Favorite  |  View/Download：33/0  |  Submit date：2021/12/02
Comparison study of gold coatings prepared by traditional and modified galvanic replacement deposition for corrosion prevention of copper 期刊论文
Microelectronics Reliability, 2020, 期号: 110, 页码: 113695
Authors:  Xingkai Zhang;  Qingyi Qian;  Li Qiang;  Bin Zhang;  Junyan Zhang
Adobe PDF(1853Kb)  |  Favorite  |  View/Download：66/1  |  Submit date：2020/11/26