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A protocol for fast electroless Ni-P on Al alloy at medium-low temperature accelerated by hierarchically structured Cu immersion layer 期刊论文
Surface & Coatings Technology, 2017, 卷号: 309, 页码: 67-74
Authors:  Kang RX(康瑞雪);  Peng ZJ(彭振军);  Liu BX(刘百幸);  Wang DA(王道爱);  Liang J(梁军);  Liang J(梁军);  Wang DA(王道爱)
Adobe PDF(1924Kb)  |  Favorite  |  View/Download：124/4  |  Submit date：2017/04/07
Cu Immersion  Deep Eutectic Solvent  Accelerator  Electroless Ni-p  Medium-low Temperature