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Role of complexing ligands in trivalent chromium electrodeposition 期刊论文
Surface and Coatings Technology, 2011, 卷号: 205, 页码: 4771-4775
Authors:  Ceng ZX(曾志翔);  Zhang YX(张英欣);  Zhao WJ(赵文杰);  Zhang JY(张俊彦);  张俊彦 zhangjunyan@licp.cas.cn
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Trivalent Chromium  Complexing Ligand  Electroreduction  Geometric Structure  
三价铬电沉积构筑纳米化防腐抗磨镀层 学位论文
: 中国科学院研究生院, 2009
Authors:  曾志翔
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三价铬电镀  摩擦磨损  腐蚀  反相畴界  Ni-co合金  Trivalent Chromium Plating  Friction And Wear  Corrosion  Anti-phase Domain Boundary  Ni-co Alloy  
The electrochemical reduction mechanism of trivalent chromium in the presence of formic acid 期刊论文
Electrochemistry Communications, 2009, 卷号: 11, 页码: 331-334
Authors:  Ceng ZX(曾志翔);  Sun YL(孙亚玲);  Zhang JY(张俊彦)
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Electrochemical Reduction Mechanism  Gga/pw91 Calculation  Trivalent Chromium  Geometric Structure