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Growth Kinetics of Copper Replacement Deposition on Al and Al-Si from a Deep Eutectic Solvent 期刊论文
Journal of The Electrochemical Society, 2015, 卷号: 162, 期号: 10, 页码: D515-D519
Authors:  Kang RX(康瑞雪);  Liang J(梁军);  Qiao ZH(乔竹辉);  Peng ZJ(彭振军);  Liang J(梁军)
Adobe PDF(756Kb)  |  Favorite  |  View/Download：122/2  |  Submit date：2015/11/04
Al-si Alloy  Copper Galvanic Replacement  Deep Eutectic Solvent  Growth Kinetics  Pure Al  
Friction and Wear Behavior of the Hybrid PTFE/Cotton Fabric Composites Filled With TiO2 Nanoparticles and Modified TiO2 Nanoparticles 期刊论文
Polymer Engineering and Science, 2009, 页码: 115-122
Authors:  Zhang HJ(张慧娟);  Zhang ZZ(张招柱);  Guo F(郭芳);  Liu WM(刘维民)
Adobe PDF(561Kb)  |  Favorite  |  View/Download：250/8  |  Submit date：2012/11/13