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单晶硅 AFM 加工过程的分子动力学模拟 期刊论文
摩擦学学报, 2011, 卷号: 31, 期号: 4, 页码: 329-334
Authors:  黄德明;  王立平;  薛群基
Adobe PDF(1426Kb)  |  Favorite  |  View/Download：268/1  |  Submit date：2012/09/24
分子动力学  单晶硅  Morse  Tersoff  切削  侧向流原子  Molecular Dynamics Simulation  Monocrystal Silicon  Cutting  Side Flow  
Ultra-high tribological performance of magnetron sputtered a-C:H films in sand-dust environment 期刊论文
Tribology Letters, 2010, 卷号: 38, 页码: 195-205
Authors:  Qi JW(亓健伟);  Wang LP(王立平);  Yan FY(阎逢元);  Xue QJ(薛群基)
Adobe PDF(1115Kb)  |  Favorite  |  View/Download：246/2  |  Submit date：2012/11/29
A-c:h FIlm  Abrasive Wear  Sand-dust Environment  Tribological Behavior  Wear Mechanism