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Growth Kinetics of Copper Replacement Deposition on Al and Al-Si from a Deep Eutectic Solvent 期刊论文
Journal of The Electrochemical Society, 2015, 卷号: 162, 期号: 10, 页码: D515-D519
Authors:  Kang RX(康瑞雪);  Liang J(梁军);  Qiao ZH(乔竹辉);  Peng ZJ(彭振军);  Liang J(梁军)
Adobe PDF(756Kb)  |  Favorite  |  View/Download：124/2  |  Submit date：2015/11/04
Al-si Alloy  Copper Galvanic Replacement  Deep Eutectic Solvent  Growth Kinetics  Pure Al  
Electrodeposition and characterization of Ni-SiC composite coatings from deep eutectic solvent 期刊论文
RSC Advances, 2015, 卷号: 5, 期号: 56, 页码: 44933-44942
Authors:  Li RQ(李瑞乾);  Chu QW(初青伟);  Liang J(梁军);  Liang J(梁军)
Adobe PDF(3727Kb)  |  Favorite  |  View/Download：117/1  |  Submit date：2015/10/28