| Comparison study of gold coatings prepared by traditional and modified galvanic replacement deposition for corrosion prevention of copper | |
| Department | 中国科学院材料磨损与防护重点实验室/先进润滑与防护材料研究发展中心 |
Xingkai Zhang1 ; Qingyi Qian2; Li Qiang1; Bin Zhang1,3; Junyan Zhang1,3
| |
| The second department | 纳米润滑课题组 |
| 2020-05-13 | |
| Source Publication | Microelectronics Reliability
 |
| Issue | 110Pages:113695 |
| Indexed By | SCI |
| If | 1.535 |
| Language | 英语 |
| compositor | 第一作者单位 |
| Document Type | 期刊论文 |
| Identifier | http://ir.licp.cn/handle/362003/26758 |
| Collection | 中国科学院材料磨损与防护重点实验室/先进润滑与防护材料研究发展中心 |
| Corresponding Author | Bin Zhang |
| Affiliation | 1.Lanzhou Institute of Chemical Physics, Chinese Academy of Sciences 2.Lanzhou University of Technology 3.University of Chinese Academy of Sciences |
| Recommended Citation GB/T 7714 | Xingkai Zhang,Qingyi Qian,Li Qiang,et al. Comparison study of gold coatings prepared by traditional and modified galvanic replacement deposition for corrosion prevention of copper[J]. Microelectronics Reliability,2020(110):113695. |
| APA | Xingkai Zhang,Qingyi Qian,Li Qiang,Bin Zhang,&Junyan Zhang.(2020).Comparison study of gold coatings prepared by traditional and modified galvanic replacement deposition for corrosion prevention of copper.Microelectronics Reliability(110),113695. |
| MLA | Xingkai Zhang,et al."Comparison study of gold coatings prepared by traditional and modified galvanic replacement deposition for corrosion prevention of copper".Microelectronics Reliability .110(2020):113695. |
| Files in This Item: | ||||||
| File Name/Size | DocType | Version | Access | License | ||
| 2020-Microelectronic（1853KB） | 期刊论文 | 作者接受稿 | 开放获取 | CC BY-NC-SA | View Application Full Text | |
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