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3D printing of release-agent retaining molds 期刊论文
Additive Manufacturing, 2023, 卷号: 71, 期号: 无, 页码: 103580
Authors:  Yang XX(杨星星);  Wu T(吴涛);  Liu DS(刘德胜);  Wu JY(吴家宇);  Wang YX(汪祎贤);  Lu YZ(鲁耀钟);  Ji ZY(姬忠莹);  Jia X(贾鑫);  Jiang P(蒋盼);  Wang XL(王晓龙)
Adobe PDF(8301Kb)  |  Favorite  |  View/Download：17/0  |  Submit date：2023/10/31
Polymer molds  Damage-free demolding  3D printing  Release agent  Low surface energy  
4D-printed light-responsive structures 专著章节文集论文
出自: Smart Materials in Additive Manufacturing:Elsevier, 2022
Authors:  Ji ZY(姬忠莹);  Jiang P(蒋盼);  Guo R(郭蕊);  Khan Rajib Hossain;  Wang XL(王晓龙)
View  |  Adobe PDF(7425Kb)  |  Favorite  |  View/Download：108/39  |  Submit date：2022/11/30
Recent advances in direct ink writing of electronic components and functional devices 期刊论文
Progress in Additive Manufacturing, 2018, 卷号: 3, 期号: 1-2, 页码: 65-86
Authors:  Pan Jiang;  Zhongying Ji;  Xiaoqin Zhang;  Zhilu Liu;  Xiaolong Wang
Adobe PDF(6579Kb)  |  Favorite  |  View/Download：99/2  |  Submit date：2018/11/27
Three Dimensional Printing  Conductive Materials  Electronic Applications