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Copper films deposited by arc ion plating at low temperatures exhibiting excellent antiwear behaviour 期刊论文
Proceedings of the Institution of Mechanical Engineers, Part J: Journal of Engineering Tribology, 2011, 卷号: 225, 页码: 1121-1129
Authors:  Gao XM(高晓明);  Sun JY(孙嘉奕);  Hu M(胡明);  Weng LJ(翁立军);  Zhou F(周峰);  Liu WM(刘维民)
Adobe PDF(447Kb)  |  Favorite  |  View/Download：377/2  |  Submit date：2012/09/24
Low Temperature  Structure  Wear Behaviour  Cu Films