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Ti-doped copper nitride films deposited by cylindrical magnetron sputtering 期刊论文
Journal of Alloys and Compounds, 2007, 卷号: 440, 页码: 254-258
Authors:  Fan XY(范晓彦);  Wu ZG(吴志国);  Zhang GA(张广安);  Li C(李春);  Geng BS(耿柏松);  Li HJ(李华军);  Yan PX(阎鹏勋)
Adobe PDF(881Kb)  |  Favorite  |  View/Download：97/0  |  Submit date：2013/11/01
Copper Nitride  Surface Morphology  Electrical Resistivity  Optical Band Gap