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Microstructure Evolution and Enhanced Tribological Properties of Cu-Doped WS2 Films 期刊论文
Tribology Letters, 2014, 卷号: 55, 期号: 1, 页码: 1-13
Authors:  Xu SS(徐书生);  Gao XM(高晓明);  Hu M(胡明);  Wang DS(王德生);  Jiang D(姜栋);  Sun JY(孙嘉奕);  Zhou F(周峰);  Weng LJ(翁立军);  Liu WM(刘维民);  Weng LJ(翁立军);  Liu WM(刘维民)
Adobe PDF(3290Kb)  |  Favorite  |  View/Download：400/7  |  Submit date：2014/12/01
Ws2 Film  Cu Dopant  Microstructure  Mechanical/tribological Properties