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Erosion and deuterium retention behavior of tungsten exposed to impurity‑seeded deuterium plasma 期刊论文
Tungsten, 2021, 期号: 3, 页码: 448-458
Authors:  张弘;  张学希;  乔丽;  王鹏
Adobe PDF(2719Kb)  |  Favorite  |  View/Download：57/0  |  Submit date：2021/11/18
Recent advances in direct ink writing of electronic components and functional devices 期刊论文
Progress in Additive Manufacturing, 2018, 卷号: 3, 期号: 1-2, 页码: 65-86
Authors:  Pan Jiang;  Zhongying Ji;  Xiaoqin Zhang;  Zhilu Liu;  Xiaolong Wang
Adobe PDF(6579Kb)  |  Favorite  |  View/Download：99/2  |  Submit date：2018/11/27
Three Dimensional Printing  Conductive Materials  Electronic Applications