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Facile galvanic replacement deposition of nickel on copper substrate in deep eutectic solvent and its activation ability for electroless Ni–P plating 期刊论文
Journal of Solid State Electrochemistry, 2022, 期号: 26, 页码: 1313–1322
Authors:  Guanqun Hu;  Rui Huang;  Hongli Wang;  Qiuping Zhao;  Xingkai Zhang
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Self-supported Materials for Flexible/Stretchable Sensors 专著章节
出自: Self-standing Substrates: Materials and Applications, Switzerland:Springer, 2020
Authors:  Li, Zhangpeng;  Huang, Jingxia;  Wang, Jinqing
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MAYA BLUE PIGMENTS DERIVED FROM CLAY MINERALS 专著章节
出自: Nanomaterials From Clay Minerals: A New Approach to Green Functional Materials, 美国/英国:Elsevier, 2019
Authors:  Dong J(董洁);  Zhang JP(张俊平)
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钛、镁及其合金材料表面减摩抗磨及耐蚀性能研究 学位论文
理学博士, 北京: 中国科学院大学, 2019
Authors:  李朝霞
Adobe PDF(8922Kb)  |  Favorite  |  View/Download:190/1  |  Submit date:2019/10/31
减摩抗磨  Ti6Al4V  防腐  AZ31 Mg  Friction-reduction  Ti6Al4V  Corrosion Resistance  
Aluminum-induced direct electroless deposition of Co and Co-P coatings on copper and their catalytic performance for electrochemical water splitting 期刊论文
Surface and Coatings Technology, 2018, 期号: 352, 页码: 42–48
Authors:  Zhang, Xingkai;  Wang, Fuguo;  Zhou, Yan;  Liang, Aimin;  Zhang, Junyan
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A protocol for fast electroless Ni-P on Al alloy at medium-low temperature accelerated by hierarchically structured Cu immersion layer 期刊论文
Surface & Coatings Technology, 2017, 卷号: 309, 页码: 67-74
Authors:  Kang RX(康瑞雪);  Peng ZJ(彭振军);  Liu BX(刘百幸);  Wang DA(王道爱);  Liang J(梁军);  Liang J(梁军);  Wang DA(王道爱)
Adobe PDF(1924Kb)  |  Favorite  |  View/Download:124/4  |  Submit date:2017/04/07
Cu Immersion  Deep Eutectic Solvent  Accelerator  Electroless Ni-p  Medium-low Temperature  
低共熔溶剂中铝/镁合金表面置换镀层及其复合镀层的制备与性能研究 学位论文
, 北京: 中国科学院大学, 2016
Authors:  康瑞雪
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低共熔溶剂  铝合金  镁合金  置换镀预处理  Deep Eutectic Solvent  Al Alloy  Mg Alloy  Galvanic Replacement Pretreatment  
Growth Kinetics of Copper Replacement Deposition on Al and Al-Si from a Deep Eutectic Solvent 期刊论文
Journal of The Electrochemical Society, 2015, 卷号: 162, 期号: 10, 页码: D515-D519
Authors:  Kang RX(康瑞雪);  Liang J(梁军);  Qiao ZH(乔竹辉);  Peng ZJ(彭振军);  Liang J(梁军)
Adobe PDF(756Kb)  |  Favorite  |  View/Download:117/2  |  Submit date:2015/11/04
Al-si Alloy  Copper Galvanic Replacement  Deep Eutectic Solvent  Growth Kinetics  Pure Al  
Copper Galvanic Replacement on Aluminum from a Choline Chloride Based Ionic Liquid: Effect of Thiourea 期刊论文
Journal of The Electrochemical Society, 2014, 卷号: 161, 期号: 10, 页码: D534-D539
Authors:  Kang RX(康瑞雪);  Liang J(梁军);  Liu BX(刘百幸);  Peng ZJ(彭振军);  Liang J(梁军)
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Superamphiphobic self-assembled monolayer of thiol on the structured Zn surface 期刊论文
Colloids and Surfaces A: Physicochemical and Engineering Aspects, 2012, 卷号: 396, 页码: 90-95
Authors:  Xu XH(徐向辉);  Zhang ZZ(张招柱);  Guo F(郭芳);  Yang J(杨进);  Zhu XT(朱小涛);  Zhou XY(周晓燕);  Xue QJ(薛群基);  Zhang ZZ(张招柱)
Adobe PDF(1827Kb)  |  Favorite  |  View/Download:240/2  |  Submit date:2013/07/12
Electroless Deposition  Surface Morphology  Superhydrophobic  Chemical Stability