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| Effect of microstructure and microtexture evolution of oxide layer over J82B steel on mechanical descaling properties 期刊论文 Materials Today Communications, 2023, 卷号: 37, 期号: 2023, 页码: 107079 Authors: Junyang Wang; Jun Jiang; Shanhong Wan; Gewen Yi; Xianglong Yu; Wei Fan; Weide Jing; Jinsong Kou; Qianqian Cheng; Yu Shan Adobe PDF(20208Kb)  |  Favorite  |  View/Download:26/0  |  Submit date:2023/12/11 |
| Sustainable utilization of natural sands for cleaner preparation of high-performance nanostructured cobalt blue composite pigments by dolomite-induced mechanochemistry 期刊论文 RSC Sustainability, 2023, 卷号: 1, 期号: 0, 页码: 1278-1289 Authors: Hao Yang; Bin Mu; Tenghe Zhang; Yushen Lu; Aiqin Wang Adobe PDF(10941Kb)  |  Favorite  |  View/Download:19/0  |  Submit date:2023/11/29 |
| Incorporation of Ag NPs/ palygorskite into chitosan/glycyrrhizic acid films as a potential antibacterial wound dressing 期刊论文 Results in Materials, 2023, 卷号: 18, 期号: 0, 页码: 100396 Authors: Qian Zhang; Hong Zhang; Aiping Hui; Yushen Lu; Aiqin Wang Adobe PDF(10958Kb)  |  Favorite  |  View/Download:23/0  |  Submit date:2023/11/29 |
| Facile fabrication of the porous adsorbent from natural plant Angelic Asinensis stabilized liquid foam for dye removal 期刊论文 Green Chemical Engineering, 2022, 卷号: 3, 期号: 1, 页码: 83-91 Authors: Fangzhi Duan; Yongfeng Zhu; Hui Yu; Aiqin Wang Adobe PDF(3719Kb)  |  Favorite  |  View/Download:36/1  |  Submit date:2022/12/09 |
| Erosion and deuterium retention behavior of tungsten exposed to impurity‑seeded deuterium plasma 期刊论文 Tungsten, 2021, 期号: 3, 页码: 448-458 Authors: 张弘; 张学希; 乔丽; 王鹏 Adobe PDF(2719Kb)  |  Favorite  |  View/Download:57/0  |  Submit date:2021/11/18 |
| Recent advances in direct ink writing of electronic components and functional devices 期刊论文 Progress in Additive Manufacturing, 2018, 卷号: 3, 期号: 1-2, 页码: 65-86 Authors: Pan Jiang; Zhongying Ji; Xiaoqin Zhang; Zhilu Liu; Xiaolong Wang Adobe PDF(6579Kb)  |  Favorite  |  View/Download:99/2  |  Submit date:2018/11/27 Three Dimensional Printing Conductive Materials Electronic Applications |