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Effect of microstructure and mechanical properties on the tribological and electrochemical performances of Si/DLC films under HCl 期刊论文
Diamond & Related Materials, 2021, 期号: 116, 页码: 108385
Authors:  Lunlin Shang;  Chengxue Gou;  Wensheng Li;  Dongqing He;  Shunhua Wang
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Rehybridization analysis of C atoms of Cu/Diamond and Ni/Diamond interfaces under vertical pressure 期刊论文
Diamond & Related Materials, 2021, 期号: 120, 页码: 108661
Authors:  Yuan Niu;  Xinghua Zhu;  Yuanpu Xu;  Zhibin Lu;  Guangan Zhang
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