| Plasma surface pretreatment to improve interfacial adhesion strengths of sputtered Cu on polyimide film | |
| Department | 固体润滑国家重点实验室（LSL） |
Enze Wang1,2; Yutao Song1; Lunlin Shang1; Guangan Zhang1 ; Shunhua Wang2
| |
| The second department | 低维润滑材料组 |
| 2022-10-19 | |
| Source Publication | Surface Topography: Metrology and Properties
 |
| Issue | 10Pages:045005 |
| If | 2.185 |
| Language | 英语 |
| compositor | 第一作者单位 |
| Document Type | 期刊论文 |
| Identifier | http://ir.licp.cn/handle/362003/29450 |
| Collection | 固体润滑国家重点实验室（LSL） |
| Corresponding Author | Lunlin Shang; Guangan Zhang |
| Affiliation | 1.State Key Laboratory of Solid Lubrication, Lanzhou Institute of Chemical Physics, Chinese Academy of Sciences 2.School of Materials Science and Engineering, Lanzhou Jiaotong University |
| Recommended Citation GB/T 7714 | Enze Wang,Yutao Song,Lunlin Shang,et al. Plasma surface pretreatment to improve interfacial adhesion strengths of sputtered Cu on polyimide film[J]. Surface Topography: Metrology and Properties,2022(10):045005. |
| APA | Enze Wang,Yutao Song,Lunlin Shang,Guangan Zhang,&Shunhua Wang.(2022).Plasma surface pretreatment to improve interfacial adhesion strengths of sputtered Cu on polyimide film.Surface Topography: Metrology and Properties(10),045005. |
| MLA | Enze Wang,et al."Plasma surface pretreatment to improve interfacial adhesion strengths of sputtered Cu on polyimide film".Surface Topography: Metrology and Properties .10(2022):045005. |
| Files in This Item: | ||||||
| File Name/Size | DocType | Version | Access | License | ||
| 18. Enze Wang. Surf （2816KB） | 期刊论文 | 作者接受稿 | 开放获取 | CC BY-NC-SA | View Application Full Text | |
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